SUNSHINE ULTRAL-THIN OPENNING CARD SS-101A
1. Using superior aluminum, rolling, polishing and other processes, breaking through the traditional process, the surface feel and internal hardness, to achieve the best state, light and convenient.
2. Configure 27 blades to disassemble the various tiny parts of the mobile phone's motherboard.
3. Ultra-thin process, small parts can be easily removed.
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SUNSHINE SS-101A BGA IC CHIP REPAIR CPU BLADE DUAL FUNCTION DEMOLITION
|AIR or SEA
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